Type of terminations

1- F type:SILVER PALLADIUM TERMINATIONS
The termination material (AgPdPt)is applied in this process by dipping the sintered ceramic bodies into the termination paste.Palladium content is about 30% and the Platinum 2% of the metal content.
This termination is suitable for adhesive or solder connections by reflow 
This termination is RoHS compliant.

2- X type: NICKEL BARRIER TIN TERMINATIONS
This termination consist of 3 superimposed layers: Silver deposited by dipping,Nickel (5µm) and Nickel (5-7µm) deposited by electroplating process.
This termination is suitable for wave soldering,reflow and infra red processes.
This termination is RoHS compliant.

3- P type: POLYMER -NICKEL- TIN terminations:"MICROFLEX TERMINATIONS"
SRT-MC develppped the polymer conductor- nickel barrier-tin for all applications where mechanical cracks might appear in the ceramic chip body during mechanical stress. 
This termination is RoHS compliant

4- H type : NICKEL BARRIER 36% LEAD 63% TIN
SRT-MC support all customers requiring lead in the termination of ceramic capacitors.

This type of termination is required in medical, aerospacce and transportataion applications